Uniwell Circuits 14 Layers RO4003C+HTG Hybrid Board HDI Board

Apr 07, 2026 Остави поруку

The 14 layers back drilling board of Uniwell Circuits is mainly used in fields that require strict signal integrity, such as high-speed communication, servers, and data centers. Through the back drilling process, useless through hole residual piles (STUBs) are removed, effectively reducing signal reflection, delay, and distortion, and improving transmission quality.

 

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Optimize signal integrity: Drill out unconnected through-hole segments (STUBs) to avoid reflection and scattering during high-speed signal transmission.
Control residual pile length: Typically, residual STUB is controlled within the range of 50-150 μ m to balance production difficulty and signal performance.
Support high-level design: suitable for multi-layer boards with 14 or more layers, meeting the requirements of complex circuit integration.

 

14 layers
RO4003C+HTG mixed pressure
1-4 layers or 1-9 layers
supports secondary drilling with controllable depth, with residual pile (Stab) <= 2mil (approximately 50.8 μ m)
Blind hole aperture as low as 0.15mm
resin plug holes, thick copper design (such as 4Oz), etc